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- home > Supply > Supply ceramic matrix laminate alumina ceramic laminate, high-quality ceramic matrix laminate, ceramic plates
Supply ceramic matrix laminate alumina ceramic laminate, high-quality ceramic matrix laminate, ceramic plates
Information Name: | Supply ceramic matrix laminate alumina ceramic laminate, high-quality ceramic matrix laminate, ceramic plates |
Published: | 2012-03-16 |
Validity: | 9999 |
Specifications: | 500 * 600 |
Quantity: | 1.00 |
Price Description: | |
Detailed Product Description: | DCB is the copper foil at a high temperature direct bonding to alumina (AL2Q3) or aluminum nitride (ALN) on the ceramic substrate surface (single or double) special process. Made of ultra-thin composite substrate with good electrical insulation properties, high heat conductivity, excellent solderability and high adhesion strength, and can be the same as the PCB etching a variety of graphics, a lot of carrier capacity. Therefore, the DCB substrate has become the basic materials of high-power electronic circuit structure and interconnect technology, is also the basis of this century packaging technology development direction of the chip-on-board "technology. 1, the DCB application ● high-power power semiconductor module; Semiconductor refrigeration, electronic heater; ● power control circuit and power hybrid circuits; ● smart power components; ● high-frequency switching power supply, solid state relays; ● automotive electronics, aerospace and military electronic components; ● solar panel components; ● telecommunications private branch exchange, the receiving system; ● Laser and other industrial electronics. 2, the DCB characteristics of ● mechanical stress, shape and stability; ● High strength, high thermal conductivity, high insulation; ● combination of strong, corrosion resistant; Excellent thermal cycling performance, cycle times up to 50000 times, high reliability; ● and the PCB (or IMS substrate) as etching the structure of a variety of graphics ● pollution-free, pollution-free; ● a wide temperature -55 ℃ ~ 850 ℃; ● coefficient of thermal expansion close to silicon, to simplify the production process of the power module. 3, the use of DCB superiority ● DBC coefficient of thermal expansion close to silicon chips, can save the buffer layer Mo film, saving labor, and materials and reduce costs; ● reduce the solder layer to reduce thermal resistance, reduce voids and improve the yield; ? in the same cross-sectional area. 0.3mm thick copper foil line width is only 10% of the ordinary printed circuit board; Excellent thermal conductivity, so that the chip package is very compact, so that the power density is greatly improved, to improve the reliability of systems and devices; ● ultra-thin (0.25mm), the DBC board alternative to BeO, environmental toxicity problems; ● carrying capacity of 100A current to pass through a 1mm wide and 0.3mm thick copper body temperature rise of about 17 ° C; 100A current to pass through a 2mm wide and 0.3mm thick copper body, the temperature rise of only 5 ° C or so; ● low thermal resistance, thermal resistance of 10 the × 10mmDCB board: Thick 0.63mm 0.31K / W Thick 0.38mm 0.19K / W Thick 0.25mm 0.14K / W ● insulation to protect the personal safety and equipment protection; ● the new packaging and assembly methods can be achieved making the product highly integrated, smaller in size. 4, DCB DCB technical parameters Technical parameters AL2O3 (≥ 96%) Maximum size mm x mm, 138 × 178 or 138 × 188 Tiles Thickness mm 0.25, 0.32, 0.38, 0.5,0.63 ± 0.07 (standard), 1.0, 1.3, 2.5 Tiles thermal conductivity W / mK 24 ~ 28 |
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Copyright © GuangDong ICP No. 10089450, Electronic Materials Co., Ltd., Dongguan City Branch All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
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You are the 15702 visitor
Copyright © GuangDong ICP No. 10089450, Electronic Materials Co., Ltd., Dongguan City Branch All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility